JPH0339260B2 - - Google Patents

Info

Publication number
JPH0339260B2
JPH0339260B2 JP57220412A JP22041282A JPH0339260B2 JP H0339260 B2 JPH0339260 B2 JP H0339260B2 JP 57220412 A JP57220412 A JP 57220412A JP 22041282 A JP22041282 A JP 22041282A JP H0339260 B2 JPH0339260 B2 JP H0339260B2
Authority
JP
Japan
Prior art keywords
carrier
manufacturing
electrical component
cavity
component according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57220412A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58113848A (ja
Inventor
Haineman Uorufugangu
Noatsuku Rainaa
Uairu Herumuuto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of JPS58113848A publication Critical patent/JPS58113848A/ja
Publication of JPH0339260B2 publication Critical patent/JPH0339260B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/403—Cells and electrode assemblies
    • G01N27/406—Cells and probes with solid electrolytes
    • G01N27/407—Cells and probes with solid electrolytes for investigating or analysing gases
    • G01N27/4075—Composition or fabrication of the electrodes and coatings thereon, e.g. catalysts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10946—Leads attached onto leadless component after manufacturing the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Molecular Biology (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Measuring Oxygen Concentration In Cells (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
JP57220412A 1981-12-09 1982-12-17 電気部品の製造法 Granted JPS58113848A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3150435.3 1981-12-09
DE19813150435 DE3150435A1 (de) 1981-12-19 1981-12-19 Verfahren zum herstellen eines elektrischen bauteils

Publications (2)

Publication Number Publication Date
JPS58113848A JPS58113848A (ja) 1983-07-06
JPH0339260B2 true JPH0339260B2 (en]) 1991-06-13

Family

ID=6149213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57220412A Granted JPS58113848A (ja) 1981-12-09 1982-12-17 電気部品の製造法

Country Status (3)

Country Link
US (1) US4524038A (en])
JP (1) JPS58113848A (en])
DE (1) DE3150435A1 (en])

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4598470A (en) * 1983-06-20 1986-07-08 International Business Machines Corporation Method for providing improved electrical and mechanical connection between I/O pin and transverse via substrate
JPH0234461B2 (ja) * 1983-06-20 1990-08-03 Intaanashonaru Bijinesu Mashiinzu Corp Hienkeipinanaakitasojudentaikibanoyobisonoseizohoho
US4849582A (en) * 1987-10-28 1989-07-18 Bell Of Pennsylvania Heat shrinkable strain relief device and method of forming same
US4847172A (en) * 1988-02-22 1989-07-11 Westinghouse Electric Corp. Low resistance fuel electrodes
US5115260A (en) * 1990-09-04 1992-05-19 International Business Machines Corporation Compact strain relief device for fiber optic cables
US7387040B2 (en) * 2005-08-19 2008-06-17 Honeywell International Inc. Methods and systems for mounting sensors for use in a harsh vibration environment
CN104254192A (zh) * 2013-06-28 2014-12-31 鸿富锦精密工业（深圳）有限公司 防板边元件短路的印刷电路板
US9859680B2 (en) 2013-12-17 2018-01-02 Lasermax, Inc. Shock resistant laser module
US10431955B2 (en) * 2014-04-25 2019-10-01 Lmd Power Of Light Corp Laser core having conductive mass electrical connection
DE102019106244B4 (de) * 2019-03-12 2020-10-01 Endress+Hauser Flowtec Ag Feldgerät der Prozessmesstechnik, Messaufnehmer und Verfahren zur Herstellung eines Messaufnehmers

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2750657A (en) * 1952-04-21 1956-06-19 Plessey Co Ltd Method of applying a metal electrode to a high permittivity ceramic
US3405382A (en) * 1965-09-13 1968-10-08 Beckman Instruments Inc Terminal and tap connections for resistance element
US3616413A (en) * 1968-10-08 1971-10-26 Westinghouse Electric Corp Solid electrolyte oxygen sensor
US3726002A (en) * 1971-08-27 1973-04-10 Ibm Process for forming a multi-layer glass-metal module adaptable for integral mounting to a dissimilar refractory substrate
CA1015827A (en) * 1974-11-18 1977-08-16 General Motors Corporation Air/fuel ratio sensor having catalytic and noncatalytic electrodes
DE2526340A1 (de) * 1975-06-12 1976-12-23 Battelle Institut E V Elektrochemischer sensor zur messung des brennstoff/luftverhaeltnisses in gasgemischen
JPS5580047A (en) * 1978-12-13 1980-06-16 Ngk Spark Plug Co Ltd Production of gas detection element
JPS55109953A (en) * 1979-02-15 1980-08-23 Ngk Spark Plug Co Ltd Manufacture of gas sensor element
DE2913866C2 (de) * 1979-04-06 1987-03-12 Robert Bosch Gmbh, 7000 Stuttgart Meßfühler für die Bestimmung von Bestandteilen in strömenden Gasen
US4374457A (en) * 1980-08-04 1983-02-22 Wiech Raymond E Jr Method of fabricating complex micro-circuit boards and substrates

Also Published As

Publication number Publication date
US4524038A (en) 1985-06-18
JPS58113848A (ja) 1983-07-06
DE3150435A1 (de) 1983-06-30
DE3150435C2 (en]) 1991-08-08

Similar Documents

Publication Publication Date Title
US6880969B2 (en) Temperature sensor and production method thereof
JPH0749277A (ja) 圧力センサ及び圧力センサの製法
JPH0339260B2 (en])
JP2000509822A (ja) 測定センサ及び測定センサを製造する方法
US20100156251A1 (en) Piezoelectric actuator and method for producing it
JPH0479538B2 (en])
JP2752649B2 (ja) セラミックヒータ
US20050175853A1 (en) Composite body made of ceramic layers and method for the production thereof
JPH02124456A (ja) 固体電解質素子の接続構造
JP2537272B2 (ja) セラミックヒ―タ
JPH0582235A (ja) スパークプラグの製造方法
JP3306586B2 (ja) 多孔質体電極部品
KR102571364B1 (ko) 3ｄ 커넥터 구조체, 3ｄ 커넥터 구조체를 제조하기 위한 방법 및 온도 센서
JP2907513B2 (ja) ガスセンサの製造方法
JP3740410B2 (ja) 検出素子
JPS6122588A (ja) 点火プラグ
JP3017273B2 (ja) セラミックヒータ
CN1016727B (zh) 制造电磁流量计电极的方法
JP4646391B2 (ja) ガスセンサ
JP2001324141A (ja) セラミックヒータ型グロープラグおよびその製造方法
JPS60262375A (ja) 点火プラグの発火電極封着方法
JPH0733355Y2 (ja) 電子管用セラミックス部材の導通リード構造
JPS6133463B2 (en])
JP4803873B2 (ja) 検出素子
JP2003133668A (ja) 回路基板